Summary
- Honda Motor and Renesas Electronics partnering to develop SoC series for software-defined vehicles (SDVs) including Honda’s new 0 Series EVs
- New SoC designed for 2,000 TOPS performance and 20 TOPS/W power efficiency, to be used in future Honda 0 Series models in late 2020s
- Series will have centralized E/E architecture combining multiple ECUs into single ECU for essential vehicle functions
- SoC developed using TSMC’s 3 nm automotive process technology to reduce power consumption
- SoC will combine Renesas’s R-Car X5 SoC series with AI accelerator optimized for AI software developed by Honda.
Article
Japanese automaker Honda Motor and semiconductor firm Renesas Electronics have partnered to develop a system-on-chip (SoC) series for software-defined vehicles (SDVs), specifically for Honda’s new 0 Series EVs. The new SoC is designed with a performance of 2,000 TOPS and power efficiency of 20 TOPS/W, and it is expected to be used in future models of the Honda 0 series to be launched in the late 2020s. The Series will adopt a centralized electrical and electronics (E/E) architecture that consolidates multiple electronic control units (ECUs) into a single ECU, serving as the core of the SDV that manages critical vehicle functions such as advanced driver assistance systems (ADAS) and automated driving (AD), powertrain control, and comfort features.
This SoC, developed using TSMC’s advanced 3 nm automotive process technology, aims to reduce power consumption while incorporating Renesas’s generic fifth-generation R-Car X5 SoC series with an AI accelerator optimized for AI software developed by Honda. The goal is to provide higher processing performance than traditional systems without significantly increasing power consumption. The partnership leverages Renesas’s expertise in semiconductors and Honda’s proficiency in automotive software to create an innovative solution for next-generation vehicles. The collaboration reflects the growing trend of automakers and technology companies working together to address the increasing complexity and functionality required in modern vehicles.
By merging multiple ECUs responsible for various vehicle functions into a single core ECU, the new SoC for SDVs streamlines the architecture of the Honda 0 Series EVs, enhancing performance and optimizing power efficiency. This centralized approach to the E/E architecture is essential for integrating the diverse functionalities required in modern vehicles, such as ADAS, AD, powertrain control, and comfort features. The development of the Series underscores the importance of advanced semiconductor technology in enabling the evolution of automotive systems towards a more software-defined and connected future.
The partnership between Honda and Renesas signifies a strategic collaboration between an automotive manufacturer and a semiconductor company to develop cutting-edge solutions for the automotive industry. By combining Renesas’s expertise in semiconductor technology with Honda’s knowledge in automotive software, the companies aim to create a SoC series tailored for SDVs, particularly for Honda’s upcoming 0 Series EVs. The integration of advanced processing capabilities and power-efficient design in the new SoC reflects the commitment of both companies to drive innovation and enhance the performance of future vehicles.
The collaboration between Honda and Renesas highlights the importance of advanced semiconductor technology in enabling the development of sophisticated automotive systems that meet the evolving needs of the industry. The utilization of TSMC’s leading-edge 3 nm automotive process technology and multi-die chiplet technology underscores the technical advancements required to support the complex functionalities of modern vehicles. Through this partnership, Honda and Renesas aim to deliver a high-performance and energy-efficient solution for SDVs, setting a new standard for automotive semiconductor technology.
Overall, the partnership between Honda and Renesas to develop a specialized SoC series for software-defined vehicles represents a significant step towards advancing the capabilities of future vehicles. By combining their respective expertise in automotive software and semiconductor technology, the companies aim to create an innovative solution that enhances the performance, efficiency, and functionality of Honda’s upcoming 0 Series EVs. The collaboration underscores the importance of semiconductor technology in enabling the evolution of automotive systems towards a more software-defined and connected future, reflecting the broader industry trend of automakers and technology companies working together to drive innovation in the automotive sector.
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