Summary

  • Industry shifting towards new technologies and topologies for power conversion
  • Gallium Nitride (GaN) and Silicon Carbide (SiC) power devices offer superior performance
  • New technologies unlocking opportunities for cost savings in power conversion systems
  • Webinar at March Virtual Conference on EV Engineering to learn about leveraging GaN and SiC
  • Other sessions include mitigating stress in PCB assemblies and exploring thermal gap fillers

Article

The power conversion industry is experiencing a shift towards new technologies such as Gallium Nitride (GaN) and Silicon Carbide (SiC) power devices, which offer superior performance characteristics leading to higher power density, faster switching speeds, and reduced losses. These innovations are aimed at reducing system costs and improving overall efficiency in power conversion systems by leveraging the unique attributes of GaN and SiC.

By combining these advanced power devices with novel topologies and packaging techniques, designers can create more compact, efficient, and reliable power conversion systems that minimize component count, reduce thermal management requirements, and optimize overall system performance. A webinar at the upcoming March Virtual Conference on EV Engineering, presented by Infineon, will delve into how designers can leverage GaN and SiC technologies to achieve cost savings and improved system performance.

In addition to the session on GaN and SiC technologies, the Virtual Conference will feature a webinar on managing stress in PCB assemblies by understanding thermal gap filler compression and PCB deflection. Thermal gap fillers play a crucial role in modern electronics for managing heat, but they can also introduce stress and deflection in PCB assemblies. The webinar, presented by Fujipoly, will cover different types of gap fillers, compression characteristics, PCB deflection, and stress management techniques to help designers make informed decisions and ensure stress-free and reliable PCB designs.

The Virtual Conference on EV Engineering, scheduled to take place from March 10-13, 2025, will cover a wide range of topics across the EV engineering supply chain and ecosystem. This includes discussions on motor and power electronics design, manufacturing, cell development, battery systems, testing, powertrains, thermal management, circuit protection, wire and cable, EMI/EMC, and more. The conference aims to provide valuable insights and information for professionals working in the electric vehicle industry to stay updated on the latest trends and developments in the field.

Attendees are encouraged to reserve their spot for the Virtual Conference, as it offers a range of informative sessions that can benefit those involved in EV engineering. Whether it’s learning about new power conversion technologies like GaN and SiC, understanding thermal management techniques for PCB assemblies, or exploring various aspects of the EV engineering supply chain, the conference aims to provide valuable knowledge and insights for industry professionals.

Overall, the Virtual Conference on EV Engineering promises to be a comprehensive event covering a wide range of topics relevant to the electric vehicle industry. With sessions on advanced power conversion technologies, thermal management strategies, and various aspects of EV engineering, attendees can gain valuable knowledge and insights to enhance their expertise and stay informed about the latest developments in the field. Reserve your spot for the conference to access these informative sessions and stay up-to-date with the evolving landscape of EV engineering.

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