Summary
- Wevo-Chemie is adding a new silicone gap filler to their line of thermal interface materials
- The WEVOSIL 26040 FL has high thermal conductivity for efficient heat dissipation
- The material is resistant to sedimentation and can be stored, used, and transported over long distances without rehomogenizing
- The filler combination allows for bridging small gaps with low bond line thickness
- The silicone gap filler meets automotive industry specifications for low-volatile emissions and is suitable for various applications in electronics and electrical engineering.
Article
German adhesives and sealants producer Wevo-Chemie has introduced a new thermal interface material called WEVOSIL 26040 FL, aimed at providing efficient heat dissipation for large surfaces. This material features high thermal conductivity of 4 W/m*K and is designed to resist sedimentation, allowing for long-distance storage, transport, and usage without the need for rehomogenization. The specially developed filler combination in WEVOSIL 26040 FL results in a low bond line thickness of less than 70 µm, facilitating the bridging of small gaps. Additionally, the material’s reactivity can be tailored to meet individual requirements, offering customization options for users.
One of the key features of WEVOSIL 26040 FL is its optimized dosing properties, which enable simple and efficient handling, high dispensing speeds, and precise dosing patterns. This enhanced dosing capability enhances production flexibility and accuracy, particularly in the manufacturing of large unit volumes. The material also offers high temperature resistance up to 200°C, flame-retardant properties compliant with UL 94 V-0 standards (starting at just 2 mm thickness), and mechanical properties such as elongation at break exceeding 30%. These properties make WEVOSIL 26040 FL suitable for a wide range of applications in electronics and electrical engineering.
WEVOSIL 26040 FL has been tested to meet the requirements of the PV 3040 test specification for low-volatile emissions in the automotive industry. This makes it a viable option for applications requiring low emissions levels, ensuring compliance with industry standards and regulations. The material’s versatility and performance characteristics make it a versatile solution for various electronic and electrical applications, catering to the needs of modern industries. Whether for high dosage volumes, reliable heat dissipation on large surfaces, or mechanically demanding thermal joints, Wevo-Chemie’s silicone gap filler offers a comprehensive solution for diverse requirements.
The introduction of WEVOSIL 26040 FL expands Wevo-Chemie’s portfolio of thermal interface materials, providing customers with a broader range of options for their specific applications. The company’s focus on developing innovative and high-performance products underscores its commitment to meeting the evolving needs of industries such as electronics and electrical engineering. By offering a silicone gap filler with advanced thermal conductivity, resistance to sedimentation, and customizable properties, Wevo-Chemie aims to address the growing demand for efficient heat dissipation solutions in contemporary electronic devices and systems.
Overall, the new silicone gap filler from Wevo-Chemie represents a significant advancement in the field of thermal interface materials, offering enhanced performance and flexibility for various applications. With its high thermal conductivity, resistance to sedimentation, customizable properties, and compliance with industry standards, WEVOSIL 26040 FL provides a reliable solution for demanding thermal management challenges. As industries continue to evolve and demand more efficient and effective solutions for heat dissipation, materials like WEVOSIL 26040 FL play a crucial role in enabling the development of innovative and reliable electronic devices and systems.
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